The AAP200x is part of AAI’s new family of specialty products for Portable Electronics applications, in this case aimed at two terminal, high sensitivity/low noise ECMs requiring integrated pre-amplifiers. The AAP200x ECM Pre-Amplifiers offer ultra low noise, require low current and ultra low input capacitance.
Multiple gain options are available, from 10dB to 26dB, as detailed in the Features list. Integrated with a 3pF microphone cartridge, the SNR can be 68dB or better. Additional design features include reduced THD, improved RF/EMC rejection and better gain accuracy.
The AAP200x will be offered in Micro SMD Package. Each die is 650 µm square and 300 µm thick (including solder balls). The packaged product will be offered in waffle pack for small quantity evaluation and tape and reel for high volume.
The AAP200x are part of AAIs new family of Portable Electronics products.
Features
- Designed for ECM Integration
- Multiple Gain Options ('x' Defines Gain Option)
- A: 10dB
- B: 14dB
- C: 16dB
- D: 20dB
- E: 26dB
- Gain Independent of Load Resistance
- Gain Tolerance +/- 0.5dB
- RL 3kΩ, 200µA quiescent current @ VDD = 2V
- Ultra Low Input Capacitance (< 1pF)
- 5 uVRMS(A-Weighted) Maximum Input Noise With Cartridge Capacitance of 3pF
- <0.5% THD Typical for Outputs to 500mVpp
- Ultra Low Profile Micro SMD Package With 4 Solder Balls
Application
- 2-Terminal, High Sensivity, Low Noise ECMs
Ordering Information | Ordering PN(1) | Subgroup | Description | Temp. Range | Package | Packing Type | Packing Qty | | AAP200x E-M4-G-LF | Micronphone ECM Interface
| Phase Cut Dimming Interface
| Pre-Amplifier | 4-Pin Micro SMD | Waffle Pack | TBD | | AAP200x E-M4-G-LF-TR | Micronphone Interface | Phase Cut Dimming Interface | Pre-Amplifier | 4-Pin Micro SMD | T&R (2), TBD | TBD | (1) Only RoHS/Lead-Free Packaging is normally offered. (2) T&R - Tape and Reel
Download the data sheet
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Download the application note |
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