ASIC Testing Capabilities
Design for testability is the surest guarantee of success. Integrated into every ASIC Advantage design is a test plan and procedure that enables us to verify the IC will perform as expected
- 100% Wafer Testing Performed at AAI
- 6 KLA Probers
- 7 Credence ASL-1000 Testers
- 2 Credence Sapphire D10
- Multiple Handler Capability (SOIC, TSOP, TSSOP, TO-53...)
- 3 EG Probers
- Tray-Tray / Tray-Tape Pick and Place Handler
- Thermonics Temperature Forcing Unit
- Burn-in Ovens for Qualification and Life Testing
- Clean Room Environment.
Package Testing done at AAI and Partners' Plants
Test hardware is duplicated with our manufacturing partners for increased volume capabilities
In-House Equipment and Methods
- Wafer Probing: Electroglass 6" high-speed manual align, KLA 6" cassette to cassette auto-align.
- Testers: Mixed signal pragmatic testers for existing products, state of the art TMT/Credence mixed signal testers, IMS digital tester capable of complex testing.
- Handlers: Hot & room temperature handlers for most popular through-hole and SMD packages.
- Temperature Testing: Fast-cycling temperature forcing units for full military range temperature testing, hot-rail handlers for DIL and SMD packages.
- Analytical Probers: Fine-probe analytical station for wafer and packages, used for troubleshooting and performance enhancement.
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